The process of SMT


First, SMT process —— single-sided assembly process

Incoming material inspection –> Screen printing solder paste (point patch adhesive) –> patch –> drying (curing ) –> reflow soldering –> cleaning –> inspection –> repair

Second, SMT process —— single-sided mixing process

Incoming material inspection –> PCB A side silk screen solder paste (point patch glue) –> patch –> drying (curing) –> reflow soldering –> cleaning –> plug –> wave soldering –> Cleaning –> Inspection –> Rework

Third, SMT process —— double-sided assembly process

A: incoming material inspection –> PCB A side silk screen solder paste (point patch glue) –> patch –> drying (curing) –> A surface reflow soldering –> cleaning –> flap –> PCB B-side silk screen solder paste (point paste glue) –> Patch –> Drying –> reflow soldering (preferably only for B side –> cleaning –> detection –> repair This process is suitable for use when a large SMD such as PLCC is attached to both sides of the PCB.

B: Incoming material inspection –> PCB A-side silk screen solder paste (point patch glue) –> Patch –> Drying (curing) –> A surface reflow soldering –> Cleaning –> Flip –> PCB B-side patch adhesive –> Patch –> Curing –> B-face wave soldering –> Cleaning –> Inspection –> Rework ) This process is suitable for PCB A surface reflow Welding, B-side wave soldering.

This process should be used in SMDs assembled on the B side of the PCB only when the SOT or SOIC (28) pins are below.

Fourth, SMT process —— double-sided mixing process

A: incoming inspection –> PCB B-side patch adhesive –> patch –> curing –> flap –> PCB A side plug –> wave solder –> cleaning –> Detection –> Rework and post-insertion, suitable for SMD components more than separate components

B: incoming material inspection –> PCB A side plug-in (pin bending) –> flap –> PCB B-side point patch glue –> patch –> curing –> flap – -> Wave soldering –> cleaning –> inspection –> repair

PICK AND PLACE MACHINE-PROFESSIONAL FOR LED DISPLAY,CAPACITY REACH 150000CPH

图片35

WhatsApp Online Chat !